Copper clad laminates are commonly used in pcb manufacturer process as follows:

 
FR-1 -- phenolic cotton paper, the base material is commonly known as electric board (higher economic efficiency than FR-2)
 
FR-2 -- phenolic cotton paper
 
Fr-3 - cotton paper, epoxy resin
 
FR-4 - Woven glass, epoxy resin
 
FR-5 -- glass cloth, epoxy resin
 
Fr-6 -- ground glass, polyester
 
G-10 - Woven glass, epoxy resin
 
CEM-1 -- cotton paper, epoxy resin (flame retardant)
 
Cem-2 -- cotton paper, epoxy resin (non flame retardant)
 
CEM-3 -- Woven glass, epoxy resin
 
Cem-4 -- Woven glass, epoxy resin
 
Cem-5 -- Woven glass, polyesters
 
Ain -- aluminum nitride
 
SiC -- silicon carbide